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Thin film forming apparatus and thin film forming method
   
Document Number
US Patent 7017637
Issued Date
March 28, 2006
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Abstract
Prior to the start of transfer of an insulation film to a substrate, the degree of opening of a butterfly valve is set small so that evaporation of a solvent component contained in the insulation film is suppressed and the fluidity of the insulation film is ensured at the start of the transfer. On the other hand, the butterfly valve is totally opened at the start of the transfer, so that the pressure inside a thin film forming chamber rapidly decreases and transfer of the insulation film to the substrate is performed always in a low-pressure state (high-degree of vacuum).
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Number of Claims:
14
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Published
March 28, 2006
Application Number
10/251,475
Filed
September 18, 2002
US Classification
156/382   118/50 156/580
Int'l Classification
C23C   14/54   (20060101)  
Examiner
Priority Data
Sep 25, 2001 [JP] 2001-290772 Aug 06, 2002 [JP] 2002-228343
USPTO Field of Search
118/50   118/712   438/455   156/230   156/286   156/282   156/540  
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