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Low application temperature hot melt adhesive
   
Document Number
US Patent 7019060
Issued Date
March 28, 2006
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Abstract
A low application temperature hot met adhesive composition and its use in carton, case or tray formation comprising from about 5 to about 60 weight percent ethylene vinyl acetate with about 30 to about 50 weight percent VA content and having a melt index of about 700 to about 4,000 dg/min; a tackifier; and wax with a melting point of about 125 to about 180.degree. F.
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Number of Claims:
14
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Published
March 28, 2006
Application Number
09/439,655
Filed
November 12, 1999
US Classification
524/270   524/272 524/277 524/487 524/489 524/508
Int'l Classification
C08L   91/06   (20060101)  
Examiner
Attorney/Law Firm
USPTO Field of Search
524/270   524/272   524/277   524/487   524/489   524/508  
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