A carrier is provided. The carrier is bonded with a substrate having a number of contact pads through an anisotropic conductive film by thermocompression. The carrier includes a base and a number of leads, wherein the base has a base's surface on which a number of indented patterns are disposed. The leads are disposed on the base's surface with their one end, which are electrically connected to the contact pads through the anisotropic conductive film, being alternately arranged with the indented patterns; meanwhile, part of the anisotropic conductive film spread into the indented patterns when the carrier is bonded to the substrate by thermocompression.
An electronic device comprises a flexible printed circuit board and a circuit board. The flexible printed circuit board comprises two first connection portions and a multifunction opening, wherein the multifunction opening comprises a flow-stopping portion and a first positioning hole, the flow-stopping portion is disposed between the two first connection portions and serves to prevent solder bridging between the connection portions during reflow, and the first positioning hole is formed to be continuous with an end of the flow-stopping portion to form a single elongated opening (120). The circuit board comprises a first positioning aperture corresponding to the first positioning hole, wherein the circuit board is connected to the flexible printed circuit board. A second positioning hole (110) and a second positioning aperture (211) may be formed on the flexible printed circuit board and the circuit board and the multifunction opening 120 may be expanded to include both the positioning holes. A pair of rods (310, 320) may be passed through the positioning holes to establish alignment.
