The invention relates to an optoelectronic module with at least one carrier element, at least one optoelectronic component that is connected to the carrier element and can emit and/or receive light, and at least one adjusting opening arranged in the carrier element for receiving at least one adjusting means. An exact positioning of the optoelectronic module can be achieved through the adjusting opening arranged in the carrier element. The invention also relates to an optoelectronic system with at least one said optoelectronic module, at least one base part and at least one adjusting means that is arranged in the base part and passes through the at least one adjusting opening of the carrier element of the optoelectronic module.
An electro-optical module comprising flexible connection cable and aligning capabilities is disclosed. Electro-optical devices may be soldered on a transparent substrate such as glass or a substrate comprising an optical waveguide wherein electrically conductive traces are designed, forming an electro-optical module. When such electro-optical module is inserted and aligned into a printed circuit board, the external part of the substrate, comprising electrically conductive traces and pads, referred to as flex-cable, is bent down toward the mounting plane of the PCB allowing to establish electrical connections between these pads and the PCB. The substrate may be brokenalong a pre-formed groove, and the external part of the substrate can be removed leaving the flex-cable section in place.
An electro-optical module comprising flexible connection cable and aligning capabilities is disclosed. Electro-optical devices may be soldered on a transparent substrate such as glass or a substrate comprising an optical waveguide wherein electrically conductive traces are designed, forming an electro-optical module. When such electro-optical module is inserted and aligned into a printed circuit board, the external part of the substrate, comprising electrically conductive traces and pads, referred to as flex-cable, is bent down toward the mounting plane of the PCB allowing to establish electrical connections between these pads and the PCB. The substrate may be broken along a pre-formed groove, and the external part of the substrate can be removed leaving the flex-cable section in place.
