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Polishing particle and method for producing polishing particle
   
Document Number
US Patent 7037352
Issued Date
May 2, 2006
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Abstract
By providing an abrasive having a ratio of volume-cumulative (95%) average particle size (D95) to volume-cumulative (50%) average particle size (D50) (D95/D50) falling within a range of 1.2 to 3.0 or an abrasive having a volume-cumulative (95%) average particle size (D95) falling within a range of 0.1-1.5 .mu.m and containing coarse particles having a size more than 10 times the volume-cumulative (50%) average particle size (D50) in an amount, based on the total mass of all the particles, of 1 mass % or less, there can be provided an abrasive, an abrasive slurry, a method for producing an abrasive, and a polishing method which attain, during accurate polishing of substrates such as electronics substrates, a high removal rate and a high-quality surface; i.e., a surface having a high flatness, low surface roughness, and substantially no microscratches or micropits.
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Number of Claims:
25
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Owner
Published
May 2, 2006
Application Number
10/012,313
Filed
December 12, 2001
US Classification
51/307   51/308 51/309
Int'l Classification
C09C   1/68   (20060101)  
Examiner
Assistant Examiner
Attorney/Law Firm
Parent Case
CROSS REFERENCE TO RELATED APPLICATIONS The present application is filed under 35 U.S.C. .sctn.111(a), and claims benefit, pursuant to 35 U.S.C. .sctn.119(e)(1), of the filing dates of Provisional Application No. 60/267,197 filed Feb. 8, 2001 and Provisional Application No. 60/283,136 filed Apr. 12, 2001, pursuant to 35 U.S.C. .sctn.111(b).
Priority Data
Dec 12, 2000 [JP] P2000-378119 Apr 05, 2001 [JP] P2001-107311
USPTO Field of Search
106/3   51/307   51/308   51/309   423/263  
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