In one embodiment, a method of forming a metallic electrode comprises depositing a metal layer over a surface (e.g., substrate) and thermally processing the metal layer to form a conductive metallized ceramic. The metal layer may be deposited by sputtering and thermally processed by rapid thermal processing, for example. Among other advantages, embodiments of the present invention allow for the formation of conductive metallized ceramics, such as titanium-nitride, without the use of relatively expensive deposition tools.
REFERENCE TO RELATED APPLICATIONS
The present application claims the benefit of U.S. Provisional Application No. 60/455,542, entitled "Method of Fabricating a Conductive Etch Stop," filed on Mar. 18, 2003 by Brent D. Lunceford, Gregory Beach, and James A. Hunter, which is incorporated herein by reference in its entirety.
The present application is a continuation-in-part of U.S. patent application Ser. No. 10/187,028, entitled "Conductive Etch Stop for Etching Sacrificial Layer," filed on Jun. 28, 2002 now U.S. Pat. No. 6,777,258 by James A. Hunter, which is incorporated herein by reference in its entirety.
