A method of manufacturing an electronic component with a contact having a terminal section for brazing and a contact section includes steps that construct a contact base member of a material that is poorly wettable, forms a primer plating layer of a material that is poorly wettable to the weld brazing material on the base member, forms a finish plating layer of a material that is highly wettable to the weld brazing material on the primer plating layer, and selectively removes a portion of the finish plating layer to obtain an exposed region of the primer plating layer that serves as an arresting region for arresting the weld brazing material from creeping up and migrating along the highly wettable finish plating layer in brazing the terminal section to the brazing pad of a wiring board.
A probe for electrical test comprises a probe body having a base end attached to a support base plate through a solder and a front end continuous with said base end and a surface layer showing a conductivity higher than that of the probe body and a solder wettability higher than that of the probe body and extending on the surface of the probe body from the base end to the front end. In the vicinity of the base end of the surface layer, a shield region having a smaller solder wettability than that of the surface layer is formed across the surface layer.
