A SMD-type LED with high heat dissipation efficiency and high power includes a base with a post arranged and integrated on the center thereof and a slot on top of the post. At least one contact hole is arranged on bottom of the base for connecting with an external heat sink so as to achieve better heat dissipation. The slot is used for accommodating a LED chip that is electrically connected with a circuitry extension device through two electrical contacts. The LED chip is electrically connected with the circuitry extension device directly while it also connects with the base for heat dissipation, thus the structure for electricity conduction is separated from the structure for heat dissipation.
A semiconductor light-emitting element assembly includes: a semiconductor light-emitting element having first and second leads, a semiconductor light-emitting element chip die-bonded to the first lead and wire-bonded to the second lead, a metal body for heat dissipation fixed to the first and second leads via an insulating adhesive layer, and a reflector fixed to the first and second leads and reflecting light from the chip; a wiring board having an opening for receiving the reflector; a heat dissipator disposed on the metal body for heat dissipation; and a fastening part for fastening the heat dissipator and the wiring board, wherein the first and second leads are fixed to the wiring board so that the reflector is received in the opening, and an interval holding part for holding an interval between the heat dissipator and the wiring board.
A wired circuit board that can allow precise connection between wired circuit boards with respect to a direction orthogonal to each other with a simple structure, while allowing reduction in size of the wired circuit boards, and a connecting structure of the wired circuit board comprising two wired circuit boards connected to each other with respect to a direction orthogonal to each other. Relay terminals 9 of the circuit suspension board 1 are arranged along one widthwise edge of the circuit suspension board 1, and terminal cutouts 10 cut in a generally semicircular arc shape from one edge thereof toward an widthwise inside thereof are formed in the relay terminals 9. In addition, insulating base layer cutouts 12 are formed in the first insulating base layer 3 to correspond to the terminal cutouts 10. The circuit suspension board 1 and a flexible wired circuit board for relay 21 are electrically connected to each other by fitting bumps 29 formed on suspension terminals 26 of the flexible wired circuit board for relay 21 in the terminal cutouts 10.
