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Document Number
US Patent 7086932
Issued Date
August 8, 2006
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Abstract
An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.
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Number of Claims:
12
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Published
August 8, 2006
Application Number
10/843,111
Filed
May 11, 2004
US Classification
451/28   451/532
Int'l Classification
B24B   1/00   (20060101)  
Examiner
USPTO Field of Search
451/28   451/41   451/36   51/298   51/299   51/300   428/295.1   428/297.4  
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7357704 - Polishing pad - Owned by innoPad, Inc. (Peabody, MA)

An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.
7534163 - Polishing pad - Owned by innoPad, Inc. (Peabody, MA)

An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.
Claims
Description
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