A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a molybdenum compound, (D-i) an organopolysiloxane, (D-ii) an organopolysiloxane cured product, or (D-iii) a block copolymer obtained by reacting an epoxy resin or alkenyl group-bearing epoxy resin with an organohydrogenpolysiloxane, and (E) an inorganic filler. The composition has improved moldability and solder crack resistance while exhibiting high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.
This application is a divisional of application Ser. No. 09/558,384, filed on Apr. 26, 2000, now U.S. Pat. No. 6,630,745 the entire contents of which are hereby incorporated by reference and for which priority is claimed under 35 U.S.C. .sctn. 120; and this application claims priority of application Ser. Nos. 11-118155 and 11-118408 both filed in Japan on Apr. 26, 1999 under 35 U.S.C. .sctn. 119.
