An LED and liquid-vapor heat-dissipating device assembly is composed of a liquid-vapor heat-dissipating device and at least one LED unit. The liquid-vapor heat-dissipating device includes a metal housing, a predetermined amount of liquid, and a capillary member. The LED unit includes an LED chip mounted to and electrically connected with the metal housing, an insulating board mounted to the surface of the metal housing, an electrode located on the insulating board, a wire having two ends connected with the LED chip and the electrode respectively, and a sealant fully encapsulating the wire and the LED chip and at least partially encapsulating the insulating board and the electrode. Accordingly, the heat generated by the LED chip can be directly conducted to the liquid-vapor heat-dissipating device and, such that the present invention has preferably thermally conductive/dissipating efficiency.

The present invention provides a radiator for a light emitting unit, annexed to the light emitting unit including a multiplicity of light emitting diodes mounted on substantially the same axis line on a first principal surface of a wiring substrate. The radiator includes a radiating plate and a heat pipe. The radiating plate is combined with the wiring substrate, with a first principal surface faced as a faying surface to a second principal surface opposite to the first principal surface of the wiring substrate, and is provided with a heat pipe fitting portion. The heat pipe is mounted into the heat pipe fitting portion of the radiating plate while keeping close contact with the inner wall of the heat pipe fitting portion. The heat generated from the light emitting diode group is transferred to a radiating means through the radiating plate and the heat pipe.

An exemplary light source module includes a printed circuit board (PCB), a heat-dissipating assembly, and a number of light emitting elements. The PCB includes a first surface, an opposite second surface, and a number of through holes. The heat-dissipating assembly is located adjacent to the second surface and includes a base, a number of heat-conducting elements, and a number of heat dissipation fins. The base includes a third surface defining a number of cavities therein and an opposite fourth surface. The heat dissipation fins extend from the fourth surface. Each of the heat-conducting elements is inlaid in a corresponding cavity. Each of the light emitting elements is placed in a corresponding through hole and thermally contacts a corresponding heat-conducting element. Each light emitting element electrically connects with the PCB and defines a respective light emitting surface located outside the corresponding through hole.