Disclosed are systems and methods for removing stubborn contaminants, aluminum fluoride and aluminum chloride in particular, from components of semiconductor-processing equipment. One embodiment forces steam through small holes in a gas distribution plate to remove build up on the interior walls of the holes. A cleaning fixture disposed between the steam source and the gas distribution plate delivers the steam at increased pressures. The gas distribution plate can be immersed in water during cleaning to capture the exiting steam.
This application is a continuation of application Ser. No. 10/664,351, filed Sep. 16, 2003, now U.S. Pat. No. 6,936,114, which is a continuation of application Ser. No. 09/879,412, filed Jun. 11, 2001, now U.S. Pat. No. 6,648,982.
