Off-chip LC circuit for lowest ground and VDD impedance for power amplifier. A novel approach is made by which a chip to PCB (Printer Circuit Board) interface may be made such that the ground and VDD potential levels are effectively brought onto the die of the chip such that a true ground potential is maintained within the chip. This off-chip LC circuit operates cooperatively with an on-chip decoupling capacitor to reduce the overall effective inductance of the bond wires employed to bring signal and voltage levels from the die to the chip exterior. This circuit ensures a relatively low impedance for a PA (Power Amplifier) that is implemented within chip thereby providing for improved performance.
CROSS REFERENCE TO RELATED PATENTS/PATENT APPLICATIONS
The present U.S. Utility patent application claims priority pursuant to 35 U.S.C. .sctn. 119(e) to the following U.S. Provisional Patent Application which is hereby incorporated herein by reference in its entirety and made part of the present U.S. Utility patent application for all purposes:
1. U.S. Provisional Application Ser. No. 60/552,759, entitled "Off-chip LC circuit for lowest ground and VDD impedance for power amplifier," filed Mar. 12, 2004, pending.
Off-chip LC circuit for lowest ground and VDD impedance for power amplifier. A novel approach is made by which a chip to PCB (Printer Circuit Board) interface may be made such that the ground and VDD potential levels are effectively brought onto the die of the chip such that a true ground potential is maintained within the chip. This off-chip LC circuit operates cooperatively with an on-chip decoupling capacitor to reduce the overall effective inductance of the bond wires employed to bring signal and voltage levels from the die to the chip exterior. This circuit ensures a relatively low impedance for a PA (Power Amplifier) that is implemented within chip thereby providing for improved performance.
