Disclosed is a socket (10) including a base (12), an array of contacts (22) in columns and rows, a plurality of positioning blocks (121) between the rows of the contacts of the base. Each of the contacts includes two deflectable contact pieces (223) at a distal region thereof to capture one ball (200) of an IC device (20) in a manner to prevent movement of that ball in a first horizontal direction. Some of the positioning blocks are arranged for preventing movement of balls of the IC device in a second horizontal direction substantially perpendicular to the first horizontal direction. Thus, the IC device may be accurately positioned on the test socket.
A socket, adapt for electrically connecting a semiconductor package to a printed circuit board, comprises an insulating base receiving a plurality of contacts, a floating board assembled to the insulating base for supporting the semiconductor package, a cover movably mounted to the insulating base and being movable on a top-to-bottom direction and a pair of latching members movably assembled to the cover. Each latching member has two ends, each end being formed with three pivots, and the cover correspondingly defines a plurality of grooves. When the cover moves downwardly, the pivots of the latching members will slide along the grooves of the cover to make the latching member rotate from a close position to an open position relative to the insulating base.
