The present invention provides at least one nozzle that sprays a rotating workpiece with an etchant at an edge thereof. The at least one nozzle is located in an upper chamber of a vertically configured processing subsystem that also includes mechanisms for plating, cleaning and drying in upper and lower chambers.
This application claims the benefit of priority under 35 USC Section 119(e) to U.S. Provisional Application Ser. No. 60/276,103 filed Mar. 14, 2001, and is a continuation of U.S. patent application Ser. No. 10/051,755 filed Jan. 15, 2002 now U.S. Pat. No. 6,777,338.
