There is provided a laser machining apparatus, and a laser machining method using the same. The laser machining apparatus has a body portion having a plurality of laser irradiating sections and work mounting sections, a supplying stocker for supplying workpieces, and a discharging stocker for discharging the workpieces. The apparatus further comprises a supply-side transfer unit having work retaining tables capable of attracting/releasing the workpieces and being of the same number as the laser irradiating sections, and moving in vertical and horizontal directions, and a discharge-side transfer unit having work retaining tables capable of attracting/releasing the workpieces and being of the same number as the laser irradiating sections, and moving in vertical and horizontal directions. The supply-side transfer unit causes the supply-side work retaining tables to attract the workpieces from the supplying stocker one after another and moves these supply-side work retaining tables to the work mounting sections to place the workpieces thereon. The discharge-side transfer unit causes the discharge-side work retaining tables to attract the work pieces which have been machined at work mounting sections, and to move and discharge these workpieces to the discharging stocker.
