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Method of routing an electrical connection on a semiconductor device and structure therefor
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Document Number
US Patent 7138327
Issued Date
November 21, 2006
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Inventors
Lee; Hun Kwang
(Penang,MY)
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Ooi; Ing Hong
(Selangor D.E.,MY)
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Abstract
In one embodiment, conductors of a semiconductor device are routed to a contact platform of the semiconductor device by using electroless plating and screen-printing techniques.
Patent Report
Tags:
method
routing
electrical
connection
semiconductor
device
structure
therefor
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Description:
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Clever 0%
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Number of Claims:
10
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Owner
Semiconductor Components Industries, LLC
(Phoenix, AZ)
Published
November 21, 2006
Application Number
10/860,613
Filed
June 4, 2004
US Classification
438/614
Int'l Classification
H01L 21/44 (20060101)
Examiner
Malsawma; Lex H.
Attorney/Law Firm
Hightower; Robert F.
Priority Data
Mar 18, 2004 [MY] PI 2004 0950
USPTO Field of Search
438/614 438/652
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