or
Bookmark and Share
Semiconductor device and method of forming the same
   
Document Number
US Patent 7148542
Issued Date
December 12, 2006
Link
Map
Abstract
An insulated gate semiconductor device comprising an insulator substrate having provided thereon a source and a drain region; a channel region being incorporated between said source and said drain regions, said channel region comprising a polycrystalline, a single crystal, or a semi-amorphous semiconductor material; and a region provided under said channel region, said region comprising an amorphous material containing the same material as that of the channel region as the principal component, or said region comprising a material having a band gap larger than said channel region.A process for fabricating the device is also disclosed.
Tags:
Description:
Amusing 0%
Clever 0%
Complex 0%
Efficient 0%
Historic 0%
Important 0%
Innovative 0%
Interesting 0%
Practical 0%
Simple 0%
Number of Claims:
12
Comments:
no comments yet
Published
December 12, 2006
Application Number
10/805,327
Filed
March 22, 2004
US Classification
257/347   257/E21.605 257/E27.111 257/E27.112
Int'l Classification
H01L   27/01   (20060101)  
Examiner
Priority Data
Feb 25, 1992 [JP] 4-073313 Feb 25, 1992 [JP] 4-073315 Mar 13, 1992 [JP] 4-089992
USPTO Field of Search
257/347  
Related Patents
7390535 - Simple chemical vapor deposition system and methods for depositing multiple-metal aluminide coatings - Owned by Aeromet Technologies, Inc. (Sandy, UT)

A chemical vapor deposition (CVD) system and method for applying an aluminide coating constituted by two or more extrinsic metal components on a jet engine component. The aluminide coating is capable of forming a protective complex oxide upon subsequent heating in an oxidizing environment. At least one of the extrinsic metals in the aluminide coating is provided as a first vapor phase reactant from a receptacle coupled by a closed communication path with the reaction chamber of the CVD system and free of a carrier gas. The aluminide coating is formed by the chemical combination of the first vapor phase reactant with a second vapor phase reactant either created in situ in the reaction chamber or supplied by a carrier gas to the reaction chamber from a precursor source.

Claims
Description
About| FAQs| Terms & Disclaimer| Link to Us| Contact Us