A method of using a run-to-run (R2R) controller to provide wafer-to-wafer (W2W) control in a semiconductor processing system is provided. The R2R controller includes a feed-forward (FF) controller, a process model controller, a feedback (FB) controller, and a process controller. The R2R controller uses feed-forward data, modeling data, feedback data, and process data to update a process recipe on a wafer-to-wafer time frame.
A GPS device and method for converting display information between a first display mode and a second display mode by negativizing pixels or other image elements, wherein negativizing entails converting relatively larger areas of lighter image elements to darker image elements and converting relatively smaller areas of darker image elements to lighter image elements so as to result in reduced total emission of light.
Disclosed is a controller having a processor and a control module adapted for periodic execution by the processor and configured to be responsive to a process variable to generate a control signal for a process. An iteration of the periodic execution of the control module involves implementation of a routine configured to generate a representation of a process response to the control signal. The routine is further configured to maintain the representation over multiple iterations of the periodic execution of the control module and until an update of the process variable is available. In some cases, the update of the process variable is made available via wireless transmission of the process signal. In those and other cases, the controller may be included within a process control system having a field device to transmit the process signal indicative of the process variable non-periodically based on whether the process variable has changed by more than a predetermined threshold. In some embodiments, the field device also transmits the process signal if a refresh time has been exceeded since a last transmission.
Methods of controlling polishing of wafers are disclosed. In one aspect, a method may include measuring one or more pre-polish thicknesses of one or more layers of a wafer. The one or more layers may then be polished. Then a post-polish thickness of a layer of the wafer may be measured. Polishing may be controlled by using feed-forward control with the one or more pre-polish thicknesses and by using feed-back control with the post-polish thickness. Machine-accessible software to perform such methods are also disclosed as are systems in which such methods may be implemented.
A method of preparing recipes for operating a metrology tool, each recipe including a set of instructions for measuring dimensions in a microelectronic feature. A database includes a plurality of known instructions with best known methods for measuring different feature dimensions by creating a summary of a recipes used by the tool, and adding categorization attributes to identify the summary for retrieval from the database. There is provided a desired recipe having instructions for measuring desired dimensions, including a summary of parameters relating to tool function for the feature dimension to be measured. The method includes comparing the instructions in the desired recipe with the instructions in the database, identifying differences therebetween, modifying the desired recipe instructions to conform to the database instructions, verifying the desired recipe prior to using the modified desired recipe by the tool, and using the desired recipe to execute a feature measurement on the tool.