Nanofibrous articles can be manufactured by a process that includes preparation of a surface of a substrate to provide an adhesion mechanism for securing the nanofibers to the surface. The nanofibers can be dispersed in an area near the substrate for the purpose of being adhered to the surface. If an ordered arrangement of nanofibers is required, an electric field can be provided in the area where the nanofibers are dispersed to selectively control an ordering of the nanofibers as they are adhered to the surface by the adhesion mechanism.
An integrated circuit chip has one or more electrically conductive nano-fibers formed on one or more contact pads of the integrated circuit chip. The one or more electrically conductive nano-fibers are configured to provide an adhesive force by intermolecular forces and establish an electrical connection with one or more contact pads disposed on the surface of a chip package.
