A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers.
RELATED APPLICATIONS
This application is a Divisional of U.S. patent application Ser. No. 10/816,882, filed Apr. 5, 2004 (which issues Nov. 15, 2005 as U.S. Pat. No. 6,964,604), which is a Continuation-In-Part of U.S. patent application Ser. No. 09/599,514, filed Jun. 23, 2000, which issued May 7, 2002 as U.S. Pat. No. 6,383,066 (Multilayered Polishing Pad, Method for Fabricating, and Uses Thereof). This application claims the benefit under 35 U.S.C. .sctn. 119(e) of Provisional Application Ser. No. 60/214,774, filed Jun. 29, 2000, entitled "Grooved Polishing Pads and Methods of Use." The entire contents of these applications is herein incorporated by reference for all purposes. This application also claims the benefit of, and specifically incorporates by reference, the entire contents of application Ser. No. 09/668,142, filed Sep. 25, 2000, which issued as U.S. Pat. No. 6,656,019.
A chemical mechanical polishing pad is suitable for polishing at least one of semiconductor, optical and magnetic substrates. The polishing pad has a high modulus component forming a continuous polymeric matrix and an impact modifier within the continuous polymeric matrix. The high modulus component has a modulus of at least 100 MPa. The impact modifier includes a low modulus component having a modulus of at least one order of magnitude less than the high modulus component that increases the impact resistance of the polishing pad.
An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.
An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.
