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Solder seals within a switching system
   
Document Number
US Patent 7231112
Issued Date
June 12, 2007
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Inventors
Sims; Tyler (Knoxville, TN)
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Abstract
A silicon chip is attached to a planar light circuit. A recessed moat is formed around an output perimeter of a surface of the silicon chip. When soldering the silicon chip to the planar light circuit, the recessed moat is filled with solder.
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Number of Claims:
4
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Published
June 12, 2007
Application Number
11/384,747
Filed
March 20, 2006
US Classification
385/28   385/14 385/15
Int'l Classification
G02B   6/26   (20060101)   G02B   6/12   (20060101)  
Examiner
Parent Case
This is a Divisional of application Ser. No. 10/639,320, filed on Aug. 12, 2003 now U.S. Pat. No. 7,039,273, the entire disclosure of which is incorporated herein by reference.
USPTO Field of Search
385/28   385/14   385/15  
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