In a quick assembling structure for LED lamp and heat dissipating module, the LED lamp set includes a casing and an LED module, and the casing has a containing hole, a stopping member protruded from an internal edge of the containing hole, a plurality of support stands extended outward from an external edge of the containing hole, and a latch portion formed on an internal side of the support stand. The LED module is contained in the containing hole of the casing and includes a base board and a plurality of LEDs fixed onto the bottom of the base board, and the heat dissipating module has an isothermal board installed on a side of the support stand of the casing, and a surface of the isothermal board is attached onto the base board of the LED module, and another surface is latched to a latch portion of the support stand. Such arrangement not only greatly reduces the labor cost for the assembling process, but also lowers the material cost for the screws.

The present invention discloses a solid state lighting package structure that breaks through the present small power packaging method to achieve the required power for lighting and overcome the heat and light issues, and uses a good heat sink and thermal conducting structure to quickly dissipate the heat produced by a chip to the outside. Special symmetric chip pattern and optical structure can evenly and efficiently guide the light out and select different color chips to meet the requirements for different color lights. The structure can be combined with a lamp easily, such that the solid state lighting can be applied for illumination easily and quickly.