An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly linear lamps for emitting light energy onto a wafer. The linear lamps can be placed in various configurations. In accordance with the present invention, tuning devices which are used to adjust the overall irradiance distribution of the light energy sources are included in the heating device. The tuning devices can be, for instance, are lamps or lasers.
RELATED APPLICATIONS
The present application is a continuation of U.S. application Ser. No. 09/747,522 filed on Dec. 21, 2000 now U.S. Pat. No. 6,970,644.
