The supraconductor device contains a rotor, which can rotate about a rotational axis, with a supraconductive coil in a heat conducting coil support. The coil support comprises a central cylindrical cavity. A cooling head, which is located outside of the rotor, of a cooling unit is connected in a heat conductive manner to a heat transfer body, which projects into the cavity of the coil support while remaining stationary. An annular gap located between the coil support and the heat transfer body is filled with a heat conducting contact gas.
