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Signal testing of integrated circuit chips
   
Document Number
US Patent 7287205
Issued Date
October 23, 2007
Link
Inventors
Lin; I-Ming (Hsin-Tien,TW)
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Abstract
A method for testing signals of integrated circuits (ICs). According to the invention, a first IC chip successively drives a number of test patterns one at a time. At the receiving end, a second IC chip latches in the test patterns one by one. Meanwhile, the second IC chip determines whether a currently latched test pattern is correct or not. If it is incorrect and at least an error bit occurs, depending on the type of the test patterns, the second IC chip indicates that there exists ground bounce or power bounce in a signal trace corresponding to the error bit.
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Number of Claims:
18
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Owner
Published
October 23, 2007
Application Number
10/614,040
Filed
July 8, 2003
US Classification
714/738   714/745
Int'l Classification
G01R   31/28   (20060101)   G06F   11/00   (20060101)  
Examiner
Attorney/Law Firm
Priority Data
Dec 23, 2002 [TW] 91137020 A
USPTO Field of Search
714/724  
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