or
Bookmark and Share
Analyzing interconnect structures
   
Document Number
US Patent 7289945
Issued Date
October 30, 2007
Link
Inventors
Jiao; Dan (Santa Clara, CA)
Map
Abstract
In one embodiment, an interconnect structure may be analyzed to determine electromagnetic characteristics of the structure by identifying structure seeds corresponding to the structure; modeling the structure seeds to obtain field patterns; and processing the field patterns to obtain the electromagnetic characteristics.
Tags:
Description:
Amusing 0%
Clever 0%
Complex 0%
Efficient 0%
Historic 0%
Important 0%
Innovative 0%
Interesting 0%
Practical 0%
Simple 0%
Number of Claims:
2
Comments:
no comments yet
Owner
Intel Corporation (Santa Clara, CA)
Published
October 30, 2007
Application Number
10/281,857
Filed
October 28, 2002
US Classification
703/14  
Int'l Classification
G06F   17/50   (20060101)  
Examiner
Assistant Examiner
Attorney/Law Firm
USPTO Field of Search
703/14  
Related Patents
Claims
Description
About| FAQs| Terms & Disclaimer| Link to Us| Contact Us