Various methods and systems measure, determine, or align a position of a laser beam spot relative to a semiconductor substrate having structures on or within the semiconductor substrate to be selectively processed by delivering a processing laser beam to a processing laser beam spot. A metrology laser beam spot is directed to one or more of those structures to be selectively processed (e.g., laser-severable conductive links), and reflections of the metrology laser beam off of those structures to be selectively processed are detected to perform the measurement, determination, or alignment. The processing laser beam can then be accurately directed onto those structures to process them on a selective basis. The various methods and systems thus utilize those structures themselves--rather than relying exclusively on dedicated alignment markers--to perform the measurement, determination, or alignment.
RELATED APPLICATIONS
This application is a continuation-in-part of U.S. patent application Ser. No. 11/213,329, entitled "Methods and Systems for Positioning a Laser Beam Spot Relative to a Semiconductor Integrated Circuit Using a Processing Target as an Alignment Target," filed Aug. 26, 2005, which is incorporated herein by reference in its entirety and to which priority is claimed under 35 U.S.C. .sctn. 120.
