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Integrated circuit with metal layer having carbon nanotubes and methods of making same
   
Document Number
US Patent 7300860
Issued Date
November 27, 2007
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Abstract
A method of fabricating an integrated circuit comprises forming or providing a solution containing carbon nanotubes and forming a metal layer utilizing the solution.
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Number of Claims:
17
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Owner
Intel Corporation (Santa Clara, CA)
Published
November 27, 2007
Application Number
10/814,375
Filed
March 30, 2004
US Classification
438/584   257/774 257/E21.174 257/E21.175 257/E21.585 257/E21.586 257/E23.165 438/674 977/847 977/857 977/936
Int'l Classification
H01L   21/20   (20060101)   H01L   21/44   (20060101)   H01L   23/48   (20060101)  
Examiner
USPTO Field of Search
977/847   977/936   977/778   977/784   977/892   977/893   977/899   977/938   438/584   438/674   438/687   257/23.165  
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