A locked hinge based technique for controllably holding surface-micromachined modules off the edge of a substrate for subsequent processing. The mechanism enables reliable, accurate, and low-cost fabrication of even complex multi layer flip-chip MEMS devices using for example only a simple two-layer module processing sequence, a sequence involving materials already in use in the process. The sequence is also free from the interference of an alignment-hindering sacrificial substrate member. The technique is disclosed by way of a micromirror example and is arranged for convenient bypassing where use of another bonding technique is desired.
The present application is related to and claims priority of prior co-pending Provisional Patent Application No. 60/419,336, filed Oct. 17, 2002 entitled "Latching Off-Chip Hinge Mechanism for Micromechanical Systems (MEMS) Components". The contents of this provisional patent application are hereby incorporated by reference herein.
