There is provided a semiconductor testing apparatus having a test head body having signal modules for processing the test signals, a plurality of connection cables electrically connected with the signal module and having connector pins at their ends, a plurality of types of connector housings for holding a plurality of connector pins, an interface plate having a plate body disposed on one face of the test head body and a plurality of connector blocks removably attached respectively to the plate body while storing a plural number of connector housings of either type among the plurality of types and a performance board for removably holding the electronic device and for electrically connecting the plurality of connector pins to the electronic device by being attached to the interface plate.
A peripheral connector includes a peripheral signal terminal set and a test signal terminal set for respectively electrically connecting a peripheral interface and a boundary scan interface of a microcomputer. A socket is selectively connectable to a peripheral device for data transmission between the peripheral device and the microcomputer or a test module for conducting a boundary scan test on the microcomputer. A converting unit has a logic circuit and a transmission circuit. The logic circuit converts an electric potential, which is transmitted from the socket and corresponds to one of the peripheral device and the test module that is connected to the socket, into a digital control signal for controlling enablement or disablement of the transmission circuit. The test module is able to conduct a boundary scan test on the microcomputer only when the transmission circuit is enabled.
