A multiple op amp IC with a single low noise op amp configuration comprises at least two op amp circuits fabricated on a common substrate. The IC can be configured such that the multiple op amps are connected in parallel to form a single op amp having output drive and input-referred noise characteristics which are superior to those of the constituent op amps. The IC can be fabricated with either first or second metallization patterns, with the first pattern providing multiple op amps with separate inputs and outputs, and the second pattern interconnecting the amplifiers to form a single op amp. The second pattern also preferably interconnects at least one set of corresponding high impedance nodes to prevent a difference voltage which might otherwise arise between the nodes due to component mismatches between the multiple op amps.
