March 25, 2008

A head assembly is provided with a mounting surface, and an integrated circuit chip which is mounted on the mounting surface and processes signals. The integrated circuit chip is covered by a layer which prevents generation of foreign particles from the integrated circuit chip by the provision of the layer.

11

March 25, 2008

10/972,440

October 26, 2004

228/1.1   156/580.1 228/49.5 257/E21.502 257/E21.503 257/E21.508 257/E21.511 257/E23.124 257/E29.022

B23K   1/06   (20060101)   B23K   37/00   (20060101)  

This application is a divisional application of U.S. patent application Ser. No. 09/548,313 filed Apr. 12, 2000 now U.S. Pat. No. 6,885,522.

May 28, 1999 [JP] 11-150599 Oct 26, 1999 [JP] 11-304629 Dec 22, 1999 [JP] 11-365546

128/1.1   128/110.1   156/13.1   156/73.2   156/580.1   156/580.2   29/872