Disclosed herein are process solutions, which may be aqueous-based, non-aqueous-based, and combinations thereof, that contain at least one alkoxylated acetylenic diol surfactant. In one aspect, the process solution comprises water and an alkoxylated acetylenic diol surfactant having the formula A: ##STR00001## where r and t are 1 or 2, (n+m) is 1 to 30 and (p+q) is 1 to 30.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a continuation-in-part of U.S. patent application Ser. No. 09/975,135, filed 11 Oct. 2001, now U.S. Pat. No. 6,864,395 which is a continuation-in-part of 09/304,607, filed 4 May 1999, now U.S. Pat. No. 6,313,182 the disclosures of which are incorporated herein by reference in their entireties. This application is also a continuation-in-part of U.S. patent application Ser. No. 10/634,608, filed 4 Aug. 2003, now abandoned which is a continuation-in-part of issued U.S. Pat. No. 09/304,607, filed May 4, 1999, the disclosures of which are incorporated herein by reference in their entireties. This application is also a continuation-in-part of U.S. patent application Ser. No. 10/804,513 filed 19 Mar. 2004, which is a continuation-in-part of 10/616,662 filed 10 Jul. 2003, now U.S. Pat. No. 7,129,199 which is a continuation-in-part of 10/339,709, filed 9 Jan. 2003, now abandoned which is a continuation-in-part of 10/218,087, filed 12 Aug. 2002, now abandoned the disclosures of the foregoing applications are incorporated herein by reference in their entirety. This application is also a continuation-in-part of 10/689,402, filed 20 Oct. 2003, now U.S. Pat. No. 7,208,049 the disclosure of which is incorporated herein by reference in its entirety.
(Object) To provide a new electronic parts cleaning solution that inhibits the corrosion of silicon or metals other than the silicon, and that efficiently cleans off fine dust or organic matters adhered on the surface of electronic parts, and that does not have white turbidity easily.(Solution) An electronic parts clearing solution which is characterized in containing an anionic surfactant, hydroxide, metal corrosion inhibitor, water, and a nonionic surfactant represented by formula (I) and/or a nonionic surfactant represented by formula (II): HO-((EO).sub.x--(PO).sub.y).sub.z--H (I) R-[((EO).sub.a--(PO).sub.b).sub.c--H].sub.m (II)(EO is an oxyethylene group, and PO is an oxypropylene group. x and y, and a and b are positive number, which x(x+y) and a(a+b) are 0.05 to 0.5 respectively, and z and c are positive integers. R is a residue group wherein hydrogen atoms are removed from hydroxyl group of alcohol or amine represented by a group having valency of 1.about.4).
Process solutions comprising one or more surfactants are used to reduce the number of defects in the manufacture of semiconductor devices. In certain preferred embodiments, the process solution of the present invention may reduce defects when employed as a rinse solution either during or after the development of the CMP processing. Also disclosed is a method for reducing the number of defects on a plurality of post-CMP processed substrates employing the process solution of the present invention.
