April 15, 2008

An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.

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April 15, 2008

11/424,466

June 15, 2006

451/532   451/28

B24D   11/00   (20060101)  

CROSS REFERENCE To RELATED APPLICATIONS The present application is a divisional of co-pending U.S. application Ser. No. 10/843,111, filed May 11, 2004, now U.S. Pat. 7,086,932 the teachings of which are incorporated herein by reference.

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7534163 - Polishing pad - Owned by innoPad, Inc. (Peabody, MA) An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.