US Patent 7365436 - Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same

Substrate having a penetrating via and wiring connected to the penetrating via and a method for manufacturing the same

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Document Number

US Patent 7365436

Issued Date

April 29, 2008

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Inventors

Yamano; Takaharu (Nagano,JP)

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Abstract

A disclosed substrate includes a base member having a through-hole, and a conductive metal filling in the through-hole so as to form a penetrating via. The penetrating via contains a conductive core member that is substantially at the central axis of the through-hole.