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| United States Patent | 7365557 |
| Link to this page | http://www.wikipatents.com/7365557.html |
| Inventor(s) | Ong; Adrian E. (Pleasanton, CA) |
| Abstract | Systems and methods of testing integrated circuits are disclosed. The
systems include a test module configured to operate between an automated
testing equipment and an integrated circuit to be tested. The testing
interface is configured to test the integrated circuit at a higher clock
frequency than the automated testing equipment is configured to operate.
In order to do so, the testing interface includes components configured
for generating addresses and test data to be provided to the integrated
circuit. A variety of test data patterns can be produced and the test
data can be address dependent. |
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Title Information  |
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| Publication Date |
April 29, 2008 |
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| Filing Date |
March 7, 2006 |
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| Parent Case |
CROSS-REFERENCE TO RELATED APPLICATIONS
The present application is a continuation of U.S. application Ser. No.
11/304,445, now U.S. Pat. No. 7,265,570 entitled "Integrated Circuit
Testing Module" and filed on Dec. 14, 2005, which in turn is: a
continuation-in-part of U.S. application Ser. No. 10/824,734, now U.S.
Pat. No. 7,139,945 entitled "Chip Testing Within a Multi-Chip
Semiconductor Package," filed on Apr. 15, 2004; a continuation-in-part of
U.S. application Ser. No. 10/870,365, now U.S. Pat. No. 7,103,815
entitled "Testing of Integrated Circuit Devices," filed on Jun. 17, 2004,
which is a continuation of U.S. application Ser. No. 09/967,389, filed on
Sep. 28, 2001, now U.S. Pat. No. 6,754,866; a continuation-in-part of
U.S. application Ser. No. 11/083,473 now U.S. Pat. No. 7,313,740 entitled
"Internally Generating Patterns For Testing In An Integrated Circuit
Device," filed on Mar. 18, 2005, which is a continuation in part of U.S.
application Ser. No. 10/205,883 entitled "Internally Generating Patterns
For Testing In An Integrated Circuit Device," filed on Jul. 25, 2002, now
abandoned; a continuation-in-part of U.S. application Ser. No.
11/108,385, now U.S. Pat. No. 7,259,582 entitled "Bonding Pads for
Testing of a Semiconductor Device," filed on Apr. 18, 2005, which is a
division of U.S. application Ser. No. 10/608,613, filed on Jun. 27, 2003,
now U.S. Pat. No. 6,882,171, which is a continuation-in-part of U.S.
application Ser. No. 10/305,635, filed on Nov. 27, 2002, now U.S. Pat.
No. 6,812,726; a continuation-in-part of U.S. application Ser. No.
11/207,581 entitled "Architecture and Method for Testing of an Integrated
Circuit Device," and filed on Aug. 19, 2005; a continuation-in-part of
U.S. application Ser. No. 11/223,286, now U.S. Pat. No. 7,245,141
entitled "Shared Bond Pad for Testing a Memory within a Packaged
Semiconductor Device," and filed Sep. 9, 2005, which is a
continuation-in-part of U.S. application Ser. No. 11/108,385, now U.S.
Pat. No. 7,259,582 filed on Apr. 18, 2005, which is a divisional of U.S.
Pat. No. 6,882,171 filed on Jun. 27, 2003, which is a
continuation-in-part of U.S. Pat. No. 6,812,726, filed on Nov., 27, 2002,
U.S. application Ser. No. 11/223,286 is also a continuation-in-part of
U.S. application Ser. No. 10/679,673, now U.S. Pat. No. 7,006,940, filed
on Oct. 3, 2003; and a continuation-in-part of U.S. application Ser. No.
11/258,484 entitled "Component Testing and Recovery," and filed Oct. 24,
2005; the entireties of the above U.S. patents and patent applications
are hereby incorporated by reference herein. |
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Title Information  |
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References  |
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| *references marked with an asterisk below are user-added references |
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U.S. References |
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| | Reference | Relevancy | Comments | Reference | Relevancy | Comments | 7114113 Yonaga et al.
Sep,2006 |      Your vote accepted [0 after 0 votes] | | 7103815 Ong et al.
Sep,2006 |      Your vote accepted [0 after 0 votes] | | 2006/0107186 Cowell et al.
May,2006 |      Your vote accepted [0 after 0 votes] | | 2005/0289428 Ong
Dec,2005 |      Your vote accepted [0 after 0 votes] | | 2005/0162182 Ong
Jul,2005 |      Your vote accepted [0 after 0 votes] | | 2004/0145935 Jakobs
Jul,2004 |      Your vote accepted [0 after 0 votes] | | 6754866 Ong et al.
Jun,2004 |      Your vote accepted [0 after 0 votes] | | 2004/0019841 Ong
Jan,2004 |      Your vote accepted [0 after 0 votes] | | 6556492 Ernst et al.
Apr,2003 |      Your vote accepted [0 after 0 votes] | | 6519725 Huisman et al.
Feb,2003 |      Your vote accepted [0 after 0 votes] | | 6484279 Akram
Nov,2002 |      Your vote accepted [0 after 0 votes] | | 6457141 Kim et al.
Sep,2002 |      Your vote accepted [0 after 0 votes] | | 6365421 Debenham et al.
Apr,2002 |      Your vote accepted [0 after 0 votes] | | 6243839 Roohparvar
Jun,2001 |      Your vote accepted [0 after 0 votes] | | 5966388 Wright et al.
Oct,1999 |      Your vote accepted [0 after 0 votes] | | 5870591 Sawada
Feb,1999 |      Your vote accepted [0 after 0 votes] | | 5825782 Roohparvar
Oct,1998 |      Your vote accepted [0 after 0 votes] | | 5666049 Yamada et al.
Sep,1997 |      Your vote accepted [0 after 0 votes] | | June 1990
Sep,1997 |      Your vote accepted [0 after 0 votes] | | | | | |
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Foreign References |
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Foreign References |
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Other References |
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| Post related web sites and other references in this section |
| | Reference | Relevancy | Comments | U.S. Appl. No. 11/744,815, Adrian Ong, Integrated Circuit Testing Module Including Multiplexed Inputs, filed May 4, 2007. cited by other. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 09/681,053, Kolluru, Mahadev S., Embedded memory architecture for video applications, filed Dec. 12, 2000. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 10/205,883, Adrian Ong, Internally generating patterns for testing in an integrated circuit device, filed Jul. 25, 2002. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 10/877,687, Adrian Ong, Multiple Power Levels for a Chip Within a Multi-Chip Semiconductor Package, Jun. 25, 2004. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 11/083,473, Adrian Ong, Internally Generating Patterns for Testing in an Integrated Circuit Device, filed Mar. 18, 2005. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 11/108,385, Adrian Ong, Bonding Pads for Testing of a Semiconductor Device, Apr. 18, 2005. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 11/207,518, Adrian Ong, Architecture and method for testing of an integrated circuit device, filed Aug. 19, 2005. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 11/207,665, Adrian Ong, Electronic device having an interface supported testing mode, filed Aug. 18, 2005. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 11/208,099, Adrian Ong, A Processor Memory Unit for Use in System-in-Package and System-in-Module Devices, filed Aug. 18, 2005. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 11/223,286, Adrian Ong, Shared bond pad for testing a memory within a packaged semiconductor device, filed Sep. 9, 2005. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 11/258,484, Adrian Ong, Component testing and recovery, filed Oct. 24, 2005. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 11/304,445, Adrian Ong, Integrated circuit testing module, filed Dec. 14, 2005. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 11/369,878, Adrian Ong, Integrated Circuit Testing Module Including Data Compression, filed Mar. 6, 2006. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 11/370,795, Adrian Ong, Integrated Circuit Testing Module Including Address Generator, filed Mar. 7, 2006. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 11/443,872, Adrian Ong, Integrated Circuit Testing Module Including Command Driver, filed May 30, 2006. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 11/472,016, Adrian Ong, Shared memory bus architecture for system with processor and memory units, filed Jun. 20, 2006. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 11/479,061, Adrian Ong, Integrated Circuit Test Array Including Test Module, filed Jun. 30, 2006. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 11/480,234, Adrian Ong, Delay Lock Loop Delay Adjusting Method and Apparatus, filed Jun. 30, 2006. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 11/538,799, Adrian Ong, Testing and Recovery in a Multilayer Device, filed Oct. 4, 2006. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | U.S. Appl. No. 11/552,938, Adrian Ong, Integrated Circuit Testing Module Including Signal Shaping Interface, filed Oct. 25, 2006. cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | US. Appl. No. 11/552,944, Adrian Ong, Integrated Circuit Testing Module Configured for Set-up and Hold Time Testing, filed Oct. 25, 2006.
cited by other
. May,2008 |      Your vote accepted [0 after 0 votes] | | |
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Market Review  |
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Technical Review  |
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Claims  |
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What is claimed is:
1. A method for testing integrated circuits comprising the steps of: receiving test address signals and test data signals from automated testing equipment at a first clock
frequency; generating first test data responsive to the test address signals by duplicating and inverting the test data signals; generating second test data responsive to a test pattern by duplicating and inverting the test data signals; and
delivering the first test data or the second test data to integrated circuits under test at a second clock frequency.
2. The method of claim 1, wherein the step of generating the second test data responsive to a test pattern includes generating the second test data using the first test data.
3. The method of claim 1, further including serializing the first test data or the second test data into an ordered sequence of bits.
4. The method of claim 1, further including selecting the test pattern from a plurality of test patterns.
5. The method of claim 1, wherein the integrated circuits under test include one or more memory devices.
6. The method of claim 1, wherein the step of generating the first test data responsive to the test address signals includes logic operations in which the first test data have a greater number of bits than the test data signals received from
the automated testing equipment.
7. The method of claim 1, wherein the step of generating the first test data responsive to the test address signals includes logic operations in which the bits of the first test data to be stored at an even address in the integrated circuits
under test are inverted.
8. The method of claim 1, wherein the step of generating the first data responsive to the test address signals includes logic operations in which the bits of the first test data to be stored at an odd address in the integrated circuit under
test are inverted.
9. The method of claim 1, wherein the step of generating second test data responsive to a test pattern includes logic operations in which the second test data have a greater number of bits than the test data signals received from the automated
testing equipment.
10. The method of claim 1, wherein the step of generating second test data responsive to a test pattern includes logic operations in which the bits of the second test data have a sequence of zeros and ones according to a data scramble pattern.
11. The method of claim 1, wherein the step of generating second test data responsive to a test pattern includes logic operations in which every other pair of bits of the second test data are inverted. |
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Claims  |
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Description  |
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BACKGROUND
1. Field of the Invention
The current invention relates to integrated circuit (IC) devices, and in particular, to the testing of integrated circuit devices.
2. Related Art
An integrated circuit (IC) device may comprise many miniaturized circuits implemented in a semiconductor substrate. IC devices must be tested in order to ensure proper operation before they are used. IC devices can be tested in a limited
fashion using built-in self test (BIST) circuitry that is implemented within the IC devices themselves. BIST testing, however, is incomplete and does not test all aspects of the device's operation. Thorough testing of an IC device is accomplished with
complex and expensive external testing equipment.
As the complexity and clock speeds of integrated circuits increase, the capabilities of existing external testing equipment can become a limiting factor in the testing of new integrated circuits. For example, the clock speeds of the fastest
memory devices increase on almost an annual basis. These memory devices cannot be tested at their maximum clock speeds using older testing equipment that was build for testing slower memory. Because of their cost, it is impractical to purchase new
testing equipment with each advance in clock speeds. There is, therefore, a need for improved systems and methods of testing integrated circuits.
SUMMARY
The present invention includes, in various embodiments, a test module configured to operate between testing equipment and one or more integrated circuits to be tested. The test module is configured to communicate with the testing equipment at a
first clock frequency and to communicate with the integrated circuits to be tested at a second, typically faster, clock frequency. In some embodiments, the test module includes components configured to generate addresses and test data for testing of
memory devices responsive to data and commands received from the testing equipment. These memory devices can include, for example, DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), Flash Memory, or the like.
The integrated circuits to be tested are optionally embedded within an electronic device. For example, in some embodiments, the integrated circuits to be tested are memory circuits within a system-on-chip (SoC), system-in-package (SiP),
system-in-module (SiM), module-in-module (MiM) package-over-package (POP), package-in-package (PiP), or the like. In these embodiments, the test module can be configured to operate the electronic device in a first mode wherein shared inputs to the
electronic device are used to for testing first circuits within the electronic device, and a second mode wherein the shared inputs are used to communicate with other circuits within the electronic device. Thus, in some embodiments, the test module is
configured to test circuits at a clock frequency faster than testing equipment being used, while also communicating to the circuits being tested in a test mode through shared inputs.
In some embodiments, the test module is programmable to generate a variety of test patterns as may be desirable for testing various types of memory architectures. For example, data generated by the test module may be configured to form a solid,
checkerboard, or striped pattern in memory being tested. The test data generated is optionally responsive to generated addresses. In some embodiments, the test module includes a command scheduler component configured to convey instructions (e.g.,
commands) to a memory device being tested, at predetermined intervals.
Various embodiments of the invention include a system comprising one or more input components configured to receive signals from an automated testing equipment at a first clock frequency, the automated testing equipment being configured to test
an integrated circuit, an address generating component configured to generate addresses responsive to the signals received from the automated testing equipment, one or more data generating components configured to generate test data responsive to the
signals received from the automated testing equipment, the test data to be delivered to the addresses generated by the address generating component, and one or more output components configured to convey the generated test data to the generated addresses
within the integrated circuit at a second clock frequency, the integrated circuit being separable from the one or more output components, the second clock frequency being a higher frequency than the first clock frequency.
Various embodiments of the invention include a method comprising attaching an automated testing equipment to a test module, attaching an integrated circuit to be tested to the test module, configuring the test module for testing of the integrated
circuit, receiving test signals from the automated testing equipment at the test module at a first clock frequency, generating test addresses within the test module responsive to the test signals received from the automated testing equipment, generating
test data within the test module responsive to the test signals received from the automated testing equipment, and sending the generated test data to the generated test addresses within the integrated circuit at a second clock frequency, the second clock
frequency being a higher frequency than the first clock frequency.
Various embodiments of the invention include a system comprising means for connecting a test module between an automated testing equipment and an integrated circuit to be tested, means for configuring the test module for testing of the integrated
circuit, means for receiving test signals from the automated testing equipment at the test module at a first clock frequency, means for generating test addresses within the test module responsive to the test signals received from the automated testing
equipment, means for generating test data within the test module responsive to the test signals received from the automated testing equipment, means for sending the generated test data to the generated test addresses wi | | |