An apparatus and method for polishing objects, such as semiconductor wafers, utilizes pivotable load/unload cups to transfer the objects to object carriers to polish the objects on at least one polishing surface. The pivoting axes of the pivotable load/unload cups are located between the object carriers.
CROSS REFERENCE TO RELATED APPLICATION
This application is entitled to the benefit of U.S. Provisional Patent Application Ser. No. 60/605,698, filed on Aug. 30, 2004, which is incorporated herein by reference.
