An attachment mount apparatus connects a subframe component to the lower frame midrail structure for an automotive vehicle that is formed from a pair of tubular members manufactured through a hydroforming process. The two tubular members are formed with a pair of opposing semi-cylindrical depressions to receive a cylindrical mounting member internally of the frame structure. One of the semi-cylindrical depressions and the corresponding outer wall of the tubular member are pierced to receive the cylindrical mount and a mounting plate. The opposing semi-cylindrical depression serves as a stop to locate the cylindrical mount along the centerline of the frame structure. The mounting plate spans the entire frame structure and is supported on four wall thicknesses to provide a stable mount structure for subframe components. The cylindrical mounting member is threaded to receive a fastener for the mounting of the subframe member.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a divisional of U.S. patent application Ser. No. 11/148,027, filed Jun. 8, 2005, now U.S. Pat. No. 7,275,785.
