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Polyoxymethylene molding compounds
   
Document Number
US Patent 7449512
Issued Date
November 11, 2008
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Abstract
Thermoplastic molding compositions, comprising A) from 15 to 99.94% by weight of a polyoxymethylene homo- or copolymer B) from 0.05 to 10% by weight of a nonpolar polypropylene wax, C) from 0.01 to 5% by weight of at least one ester or amide of saturated or unsaturated aliphatic carboxylic acids having from 10 to 40 carbon atoms with saturated aliphatic alcohols or amines having from 2 to 40 carbon atoms, D) from 0 to 80% by weight of other additives, where the total of the percentages by weight of components A) to D) is always 100%.
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Number of Claims:
20
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Owner
BASF SE (Ludwigshafen,DE)
Published
November 11, 2008
Application Number
10/554,691
Filed
April 24, 2004
US Classification
524/487   524/210 524/223 524/230 524/315 524/318
Int'l Classification
C08L   91/06   (20060101)  
Examiner
Attorney/Law Firm
Priority Data
Apr 30, 2003 [DE] 103 19 740
USPTO Field of Search
524/210   524/223   524/230   524/315   524/318   524/487  
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