A thin ribbon spirally wound polymer conduit and method of forming, wherein a helical reinforcing bead is interposed adjacent overlapping layers of ribbon. Further, a method of continuously forming spirally wound conduit wherein a sacrificial layer, preferably having a different base polymer to that of the conduit, is first applied to the former before the conduit is formed overtop.
RELATED APPLICATION (PRIORITY CLAIM)
This patent application is a divisional of U.S. patent application Ser. No. 10/656,574, filed Sep. 5, 2003, now U.S. Pat. No. 7,291,240, and entitled "Conduit and Method of Forming", which claims priority from New Zealand Patent Application No. 521274, filed Sep. 9, 2002 and New Zealand Patent Application No. 521364, filed Sep. 11, 2002.
