January 13, 2009

Embodiments of a composite carbon nanotube structure comprising a number of carbon nanotubes disposed in a matrix comprised of a metal or a metal oxide. The composite carbon nanotube structures may be used as a thermal interface device in a packaged integrated circuit device.

8

January 13, 2009

11/360,096

February 22, 2006

257/706   257/276 257/475 257/625 257/675 257/717 257/720 257/796 257/E23.09 257/E23.11

H01L   23/34   (20060101)   H01L   23/10   (20060101)   H01L   23/28   (20060101)   H01L   23/48   (20060101)   H01L   23/495   (20060101)   H01L   29/06   (20060101)   H01L   29/47   (20060101)   H01L   29/80   (20060101)  

CLAIM OF PRIORITY This application is a divisional of U.S. patent application Ser. No. 10/607,525, filed Jun. 25, 2003, now U.S. Pat. No. 7,112,472. RELATED APPLICATION This application is related to application Ser. No. 10/607,390, entitled "Method of Fabricating a Composite Carbon Nanotube Thermal Interface Device", filed on even date herewith Jun. 25, 2003.