A fixed parallel plate micro-mechanical systems (MEMS) based sensor is fabricated to allow a dissolved dielectric to flow through a porous top plate, coming to rest on a bottom plate. A post-deposition bake ensures further purity and uniformity of the dielectric layer. In one embodiment, the dielectric is a polymer. In one embodiment, a support layer is deposited onto the top plate for strengthening the sensor. In another embodiment, the bottom plate is dual-layered for a narrowed gap. Integrated circuit arrays of such sensors can be made, having multiple devices separated from each other by a physical barrier, such as a polycrystalline containment rim or trough, for preventing polymer material from one sensor from interfering with that of another.
RELATED APPLICATIONS
This non-provisional patent application is: a divisional of, and claims the benefit of and priority to, U.S. Non-provisional Application No.: 10/242,966, filed Sep. 13, 2002 now U.S. Pat. No. 7,115,969. The foregoing non-provisional application is hereby incorporated by reference in it entirety for all purposes.
