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Formaldehyde free electroless copper compositions
   
Document Number
US Patent 7501014
Issued Date
March 10, 2009
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Abstract
Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.
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Number of Claims:
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Published
March 10, 2009
Application Number
11/825,549
Filed
July 6, 2007
US Classification
106/1.23   106/1.26 427/443.1 427/97.9
Int'l Classification
C23C   18/38   (20060101)   B05D   5/12   (20060101)   C23C   18/40   (20060101)   H05K   3/18   (20060101)  
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USPTO Field of Search
106/1.23   106/1.26   427/97.9   427/443.1  
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