The invention broadly and generally provides a connection structure for connecting a microelectronic device to a substrate, the aforesaid connection structure comprising: (a) a metal layer electrically connected to the aforesaid microelectronic device; (b) an interface element attached to an interface portion of the aforesaid metal layer; (c) a metallic solder element attached to the aforesaid interface element at an interface region of the aforesaid metallic solder element; and (d) a current dispersing structure operable to spatially disperse an electric current, the aforesaid current dispersing structure comprising an electrically insulating material and being disposed within at least one of the aforesaid interface portion, the aforesaid interface element, and the aforesaid interface region.
