Disclosed herein is a method of making integrated circuits. In one embodiment the method includes forming tungsten plugs in the integrated circuit and forming electrically conductive interconnect lines in the integrated circuit after formation of the tungsten plugs. At least one tungsten plug is electrically connected to at least one electrically conductive interconnect line. Thereafter at least one electrically conductive interconnect line is exposed to ionized air.
CROSS-REFERENCE TO RELATED APPLICATIONS
This application is a continuation of U.S. patent application Ser. No. 10/695,528, entitled "Tungsten Plug Corrosion Prevention Method Using Ionized Air," filed Oct. 28, 2003, and naming John W. Jacobs and Elizabeth A. Dauch as inventors, now U.S. Pat. No. 7,052,992, issued May 30, 2006.
