Porous dielectric layers are produced by embedding and removing nanoparticles in composite dielectric layers. The pores may be produced after the barrier material, the metal or other conductive material is deposited to form a metallization layer. In this manner, the conductive material is provided with a relatively smooth continuous surface on which to deposit.
CROSS-REFERENCE TO RELATED APPLICATION
This application is a continuation-in-part of and claims priority under 35 USC .sctn.120 to U.S. patent application Ser. No. 11/050,621, filed Jan. 31, 2005 now U.S. Pat. No. 7,166,531, which is hereby incorporated by reference in it entirety.
