An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component.
CROSS REFERENCE TO RELATED APPLICATIONS
The present application is a divisional of U.S. patent application Ser. No. 11/424,466, filed on Jun. 15, 2006, entitled "Polishing Pad," which is a divisional of U.S. application Ser. No. 10/843,111, filed May 11, 2004, entitled "Polishing Pad," now U.S. Pat. No. 7,086,932, the disclosures of which are incorporated by reference herein in their entireties.
