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Electroless gold plating solution
   
Document Number
US Patent 7534289
Issued Date
May 19, 2009
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Abstract
An electroless gold plating solution that can form a gold plating film with excellent adhesion and that does not cause corrosion of a base metal film such as nickel, copper, cobalt, or palladium, or the like.
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Number of Claims:
9
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Published
May 19, 2009
Application Number
12/217,241
Filed
July 2, 2008
US Classification
106/1.23   106/1.26
Int'l Classification
C23C   18/31   (20060101)  
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USPTO Field of Search
106/1.23   106/1.26  
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