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Diffusion plate assembly
 
   
Document Number
US Patent 7540648
Issued Date
June 2, 2009
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Inventors
Cheng; Wen-Feng (Taoyuan County,TW)
Lee; Chen-Sheng (Taoyuan County,TW)
Lin; Chao-Ying (Taoyuan County,TW)
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Abstract
A diffusion-plates assembly and a direct-type backlight module assembly are provided. The diffusion-plates assembly includes a first diffusion plate and a second diffusion plate. There are pluralities of first microstructures on the emergent surface of the first diffusion plate, the first microstructures is for condensing light. The thickness of the first diffusion plate is above 0.4 mm, and the transmittance of the first diffusion plate is above 90%. The second diffusion plate is placed over or under the first diffusion plate, The thickness of the second diffusion plate is above 0.4 mm, and the transmittance of the second diffusion plate is 50.about.90. Said diffusion-plates assembly is used in the direct-type backlight module assembly.
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Number of Claims:
22
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Owner
Entire Technology Co., Ltd. (Taoyuan County,TW)
Published
June 2, 2009
Application Number
11/772,000
Filed
June 29, 2007
US Classification
362/607   362/612
Int'l Classification
F21V   7/04   (20060101)  
Examiner
USPTO Field of Search
362/607   362/97   362/612   362/331   349/112   349/63   349/64  
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